Basler ToF640 Alternatives & Competitors

The Intel® RealSense™ Depth Camera D415 stands out for its standard field of view, making it well-suited for high-accuracy applications like 3D scanning. With a rolling shutter on the depth sensor, it offers the highest depth quality per degree, enabling precise measurements for smaller objects or when more accuracy is required. The D415 is lightweight, powerful, and cost-effective, making it an ideal choice for development and productization of new sensing solutions and devices that can better understand and interact with their surroundings.

This camera is part of the Intel® RealSense™ D400 series, which includes a complete suite of solutions for simple integration. It combines Intel's latest depth-sensing hardware and software into easy-to-integrate products, including vision processors, turnkey modules, cameras, SDKs, and computer vision libraries. As a result, developers, makers, and innovators can easily bring depth-sensing vision to their devices, fostering a new generation of intelligent vision-equipped solutions.

In industrial automation, the D415's high depth quality and precise measurement capabilities make it a valuable tool for various applications. Its ability to accurately sense and understand the environment can enhance robot guidance, object detection, and inspection tasks. Furthermore, its small form factor and customizable software allow for easy integration into existing systems, making it a versatile option for a wide range of industrial use cases. Additionally, its compatibility with Intel's vision processors and SDKs offers the potential for advanced real-time processing and data analytics in industrial environments.

The Intel® RealSense™ Depth Camera D455 is the latest addition to the D400 series, offering twice the range and improved performance. With a distance of 95 mm between depth sensors, the D455 achieves depth error of less than 2% at 4 meters. The integration of an IMU allows for enhanced environmental awareness in robotic and drone applications, refining depth awareness during camera movement.

The D455 provides more accuracy and flexibility for various use cases. Its longer range makes it ideal for collision avoidance in fast-moving autonomous robots, ensuring safer operation in dynamic environments. The tightly integrated RGB and depth streams with a global shutter on the RGB sensor improve the correlation between color and depth information, resulting in better quality scanning. For touch-free displays in public spaces, the longer range of the D455 enables reliable gesture control and interaction from a greater distance. Additionally, multiple D455 cameras can be easily set up together for volumetric content creation, offering real-time scene capture at up to 90 frames per second, both indoors and outdoors.

The Helios2 Time of Flight (ToF) camera is an IP67 “factory tough” 3D camera featuring Sony’s DepthSense sensor, engineered for high performance operation in industrial environments. Built for demanding 24/7 environments and a variety of industrial 3D applications such as robotics, 3D inspection, and logistics, including advanced material handling, pick and place, sorting, palletization / de-palletization, volume estimation, and more. The Helios2 delivers sub-millimeter precision and improved accuracy compared to the previous Helios. The calibration between the VCSELs and sensor timing is enhanced resulting in more 3D detail, along with improved edge detection to reduce flying pixels and overall noise.

Industrial ToF depth camera

Ethernet and RS485 Interface

Support POE+/DC as power supply

KEY FEATURES

• IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.

• Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again.

OUTDOOR STRONG LIGHT EFFECT

DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux

Industrial ToF depth camera

USB 2.0 & RS485 Interface

KEY FEATURES

• IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.

• Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again.

OUTDOOR STRONG LIGHT EFFECT

DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux

The modular and flexible 3D camera system

The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.

The camera mounting brackets are available in a range of widths to allow for the implementation of base lines with different sizes. You can also configure the camera's angle of view and choose between various C-mount lenses with different focal lengths for the camera and projector. This flexibility facilitates a wide range of working distances of more than 5 metres, allowing you to capture objects with volumes of several cubic metres, e.g. heavily-laden pallets or entire rooms. You can choose between camera models with 1.3 megapixel or 5 megapixel resolution for an even greater field of view and a higher level of detail.

For particularly high demands on robustness, the Ensenso X30 and Ensenso X36 3D camera systems are optionally available with IP65/67 and therefore protected against dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.

the 3D-Sensors of the new C5 Series come with resolutions of up to 12-Megapixel and collect the 3D data with measuring speeds of up to 200,000 Profiles per second (depending on the model). The developers have devoted special attention to industrial suitability and have equipped the 3D sensors with a ruggedized housing (IP67), M12 connectors, air barriers and many more features.

Until now, 3D-recordings in a two-digit megapixel resolution were reserved only for the camera C4-4090-GigE. The C5 Series combines the high-resolution characteristics of the C4 camera with the compact and ruggedized design of the C2 sensor family, merging thanks to state-of-the-art technology the best of both worlds. The result is ultra-high resolution high-speed 3D-sensors that enable a reliable industrial use even in harsh environments.

Details:

• Non-Contact 3D Measurement in Accordance with the Laser-Sheet of Light (Triangulation) Method
• Measuring Speeds of up to 200 kHz
  
• Image Processing Integrated in the Camera
  
• Robust Housing with IP67
  
• Configurable Camera Modes: Image Mode, Profile Mode
  
• Selection of 3D Camera Algorithms: Threshold-Selection Method, Maximum Method, COG Method, FIR-PEAK Method
  
• All algorithms achieve the maximum profile rate, regardless of the algorithm selected and its parameters
  
• Easy Configuration via Camera Register
  
• Configurable Selection of the Data Output, e.g. Height Data or Height Data + Intensity Data
  
• Genuine Global Snapshot Shutter for Accurate Profiles without Movement Distortion (blurring)
  
• Programmable Number of Profiles that can be merged to form a Height Image
  
• Up to 8 Freely Selectable AOIs (Sensor Read-Out Windows) in Image and Profile Mode
  
• Flexible Trigger Functions for Profile and Image Triggering
  
• RS422 Interface Converter with Programmable Counter for Profile Trigger Generation and Integral
• Identification of Direction of Movement
  
• Data Transmission via Gigabit Ethernet Interface
  
• Configurable Opto-Coupled I/Os for Trigger Function and Synchronisation
  
• Storage of a User-Defined Start-Up Camera Configuration in a Configuration EEprom
  
• Integrated Control for External Illumination (Laser)
  
• Enhanced 3D Imaging with High Dynamic Range 3D (HDR-3D)

Industrial ToF depth camera

Aviation Plugs, IP67 rating

Ethernet and RS485 Interface Support

POE+/DC as power supply

KEY FEATURES

• IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.

• Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again.

OUTDOOR STRONG LIGHT EFFECT

DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux

The KEYENCE 3D VGR series excels in object detection and user-friendliness. Suited for assembly, de-palletizing, and machine tending, it employs a 4-camera, 1-projector imaging unit to capture 136 images with striped-light patterns. Setup involves auto robot-camera calibration and CAD data upload. The Path Planning tool calculates collision-free robot motion paths for efficient object handling. A Picking Simulator enables gripper and cell design testing during work cell setup.

Unique features encompass specialized optics and advanced 3D search algorithms, ensuring precision and speed. The 4-camera setup eliminates blind spots for optimal 3D imaging. The system's novel 3D search function assures stable target detection in any orientation, bolstering accuracy. These capabilities make the KEYENCE 3D VGR series an adept solution for industrial automation.

Integrated Design Comprised of Four Cameras and a Single Projector

Automatically Calculate Movements for the Robot, Taking Peripheral Equipment and the Position of the Robot into Account

Path Planning Tool

Automatic Robot Path Planning

Robot motion paths are automatically calculated to eliminate all collisions of the robot, target, and surroundings to greatly reduce robot programming time and to allow for uninterrupted bin picking operation.

Picking Simulator

Worksite Modeling Simulation

The workcell and program can be designed in the Simulator before any physical setup is completed, which can identify potential setup problems and dramatically increase bin picking success rates.