Lucid Vision Helios2 Time of Flight 3D Camera Alternatives & Competitors

Get an IP67 “factory tough”, high-performance 3D camera with the accuracy and precision you need powered by LUCID’s 3D ISP core and Sony’s DepthSense IMX556 Time-of-Flight (ToF) sensor. With the Helios2+ camera delivering two new features – High Dynamic Range (HDR) and High-Speed modes – over the original Helios2, the Helios2+ provides unmatched depth data clarity and high-speed 3D imaging for 24/7 operation in harsh industrial environments.

Helios2+ Time-of-Flight Camera with On-Camera HDR & High Speed Features

The Helios2+ is an advanced version of the Helios2 ToF camera offering two new key features enabling deployment in challenging environments, High Dynamic Range (HDR) mode and High Speed Time-of-Flight mode, while retaining all other benefits of the Helios2. Both HDR and High-Speed modes are realized entirely with on-camera processing and will impair minimal changes on the vision systems back-end. The Helios2+ shares the same ‘factory tough’ industrial platform with its predecessor and is 100% mechanically and electronically compatible with the Helios2 to offer a seamless upgrade path for existing customers. Its compact form factor, industrial reliability and attractive price point make the Helios2+ ideal for many demanding 3D applications such as 3D inspection, automated material handling and robotics to run more efficiently while reducing overall system cost.

• World’s fastest 3D sensor in the combination of speed and resolution
• Advanced 3D technology (HDR-3D)
• Intelligent line detection algorithms with advanced filtering and validation for highly accurate scans
• Wide measuring range
• Available as 3D camera, 3D sensor and MCS module
• Industrial protection class IP67
• Service-friendly design

Optimization C6 Series Compared to C5 Series:
C6-3070 with on-sensor processing for world’s fastest 3D profiling based on AT’s own sensor technology
C6-4090 is 1.8 times faster compared to the C5-4090 with the same resolution
Unique new MultiPart feature: parallel output of up to nine different features (e.g. range, reflectance, scatter) at maximum profile speed with optimized pixel formats
Unique new feature MultiPeak: output of up to four different peaks for even more robust 3D data and for scanning transparent objects
Support of the latest 3D standard through GenICam 3.0

Industrial ToF depth camera

Ethernet and RS485 Interface

Support POE+/DC as power supply

KEY FEATURES

• IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.

• Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again.

OUTDOOR STRONG LIGHT EFFECT

DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux

Industrial ToF depth camera

USB 2.0 & RS485 Interface

KEY FEATURES

• IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.

• Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again.

OUTDOOR STRONG LIGHT EFFECT

DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux

Industrial ToF depth camera

Aviation Plugs, IP67 rating

Ethernet and RS485 Interface Support

POE+/DC as power supply

KEY FEATURES

• IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.

• Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again.

OUTDOOR STRONG LIGHT EFFECT

DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux

Mech-Eye PRO S Industrial 3D Camera:

- High accuracy

- Detail-rich 3D point cloud images

- Rapid image acquisition

- Designed for short- and medium-range applications

Mech-Eye DEEP Industrial 3D Camera:

- Large FOV

- Deep depth of field

- Suitable for large FOV applications

Mech-Eye PRO M Industrial 3D Camera:

- High accuracy

- Extended FOV

- Detail-rich 3D point cloud images

- Rapid image acquisition

- Designed for medium-range robotic applications

The modular and flexible 3D camera system

The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.

The camera mounting brackets are available in a range of widths to allow for the implementation of base lines with different sizes. You can also configure the camera's angle of view and choose between various C-mount lenses with different focal lengths for the camera and projector. This flexibility facilitates a wide range of working distances of more than 5 metres, allowing you to capture objects with volumes of several cubic metres, e.g. heavily-laden pallets or entire rooms. You can choose between camera models with 1.3 megapixel or 5 megapixel resolution for an even greater field of view and a higher level of detail.

For particularly high demands on robustness, the Ensenso X30 and Ensenso X36 3D camera systems are optionally available with IP65/67 and therefore protected against dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.

The modular 3D camera system with onboard processing

The Ensenso XR series combines the flexible, modular design of the Ensenso X series with the advantages of an embedded system. The new powerful XR projector unit with integrated system on chip processes the image data independently, making 3D data available directly from the camera. The 3D performance of the XR series can compete with that of a powerful Core i7 desktop CPU. By shifting the compute-intensive calculations to the camera, they no longer have to be performed by powerful industrial PCs. In addition, the transfer of 3D result data instead of high-resolution 2D raw data reduces the network load. Multi-camera systems in particular benefit from the resource-saving features of the new XR series.

A built-in front light supports calibrating the work environment as well as the image quality of the 2D camera images. Besides the GigE data connection, an additional WiFi interface is planned, which will be very useful for temporary access to data and parameters when wiring is difficult or cost-intensive.


Similar to the X-series, the XR-series can be flexibly adjusted with selected GigE uEye camera models to a 3D camera system customized to your requirements. With different base lines and focal lengths, working distances of more than 5 meters can be realized and objects with volumes of several cubic meters can be captured, such as heavily laden pallets or entire rooms. The first Ensenso XR models feature 1.6 MP Sony sensors and are protected by IP65/67 against dirt, dust, splash water or cleaning agents, as well as against accidental shifting of the optics.