Lucid Vision Helios2 Time of Flight 3D Camera Specifications

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Ranked Nr. 104 of 97 3D Vision Systems

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The Helios2 Time of Flight (ToF) camera is an IP67 “factory tough” 3D camera featuring Sony’s DepthSense sensor, engineered for high performance operation in industrial environments. Built for demanding 24/7 environments and a variety of industrial 3D applications such as robotics, 3D inspection, and logistics, including advanced material handling, pick and place, sorting, palletization / de-palletization, volume estimation, and more. The Helios2 delivers sub-millimeter precision and improved accuracy compared to the previous Helios. The calibration between the VCSELs and sensor timing is enhanced resulting in more 3D detail, along with improved edge detection to reduce flying pixels and overall noise.

Operating range 0.3 m
Protection (IP) 67
Image Type
  • Color
  • Hyperspectral
  • Monochrome
  • Multispectral
  • MWIR
  • Near-infrared
  • SWIR
Resolution 640

Helios2 Time of Flight 3D Camera Alternatives

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Lucid Vision Helios2+ Time of Flight 3D Camera
Monochrome
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Get an IP67 “factory tough”, high-performance 3D camera with the accuracy and precision you need powered by LUCID’s 3D ISP core and Sony’s DepthSense IMX556 Time-of-Flight (ToF) sensor. With the Helios2+ camera delivering two new features – High Dynamic Range (HDR) and High-Speed modes – over the original Helios2, the Helios2+ provides unmatched depth data clarity and high-speed 3D imaging for 24/7 operation in harsh industrial environments. Helios2+ Time-of-Flight Camera with On-Camera HDR & High Speed Features The Helios2+ is an advanced version of the Helios2 ToF camera offering two new key features enabling deployment in challenging environments, High Dynamic Range (HDR) mode and High Speed Time-of-Flight mode, while retaining all other benefits of the Helios2. Both HDR and High-Speed modes are realized entirely with on-camera processing and will impair minimal changes on the vision systems back-end. The Helios2+ shares the same ‘factory tough’ industrial platform with its predecessor and is 100% mechanically and electronically compatible with the Helios2 to offer a seamless upgrade path for existing customers. Its compact form factor, industrial reliability and attractive price point make the Helios2+ ideal for many demanding 3D applications such as 3D inspection, automated material handling and robotics to run more efficiently while reducing overall system cost.
Automation Technology C6 Series
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World’s fastest 3D sensor in the combination of speed and resolutionAdvanced 3D technology (HDR-3D)Intelligent line detection algorithms with advanced filtering and validation for highly accurate scansWide measuring rangeAvailable as 3D camera, 3D sensor and MCS moduleIndustrial protection class IP67Service-friendly design Optimization C6 Series Compared to C5 Series:C6-3070 with on-sensor processing for world’s fastest 3D profiling based on AT’s own sensor technologyC6-4090 is 1.8 times faster compared to the C5-4090 with the same resolutionUnique new MultiPart feature: parallel output of up to nine different features (e.g. range, reflectance, scatter) at maximum profile speed with optimized pixel formatsUnique new feature MultiPeak: output of up to four different peaks for even more robust 3D data and for scanning transparent objectsSupport of the latest 3D standard through GenICam 3.0
Vzense Technology DCAM550-P
Monochrome | Working distance 350-6000 mm
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Industrial ToF depth camera Ethernet and RS485 Interface Support POE+/DC as power supply KEY FEATURESIR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space.Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again. OUTDOOR STRONG LIGHT EFFECT DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux
Vzense Technology DCAM550-U
Monochrome | Working distance 350-6000 mm
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Industrial ToF depth camera USB 2.0 & RS485 Interface KEY FEATURES IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space. Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again. OUTDOOR STRONG LIGHT EFFECT DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux
Vzense Technology DCAM550-E
| Working distance 350-6000 mm
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Industrial ToF depth camera Aviation Plugs, IP67 rating Ethernet and RS485 Interface Support POE+/DC as power supply KEY FEATURES IR and depth output simultaneouslyVzense ToF products can output 12 bit depth images and black-and-white images at the same time. The two images are completely aligned in time and space. Passive trigger modeDCAM550 series can work in the passive trigger mode, which means DCAM550 series is always in the slave standby mode, waiting to receive the trigger signal to start acquiring one frame of data, subsequently, entering the slave standby mode again. OUTDOOR STRONG LIGHT EFFECT DCAM550 series works perfectly under extreme sunlightTest condition: 82k lux
MECH MIND PRO S
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Mech-Eye PRO S Industrial 3D Camera: - High accuracy - Detail-rich 3D point cloud images - Rapid image acquisition - Designed for short- and medium-range applications
MECH MIND DEEP
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Mech-Eye DEEP Industrial 3D Camera: - Large FOV - Deep depth of field - Suitable for large FOV applications
MECH MIND PRO M
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Mech-Eye PRO M Industrial 3D Camera: - High accuracy - Extended FOV - Detail-rich 3D point cloud images - Rapid image acquisition - Designed for medium-range robotic applications
IDS ENSENSO X SERIES
Working distance 0mm
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The modular and flexible 3D camera system The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system. The camera mounting brackets are available in a range of widths to allow for the implementation of base lines with different sizes. You can also configure the camera's angle of view and choose between various C-mount lenses with different focal lengths for the camera and projector. This flexibility facilitates a wide range of working distances of more than 5 metres, allowing you to capture objects with volumes of several cubic metres, e.g. heavily-laden pallets or entire rooms. You can choose between camera models with 1.3 megapixel or 5 megapixel resolution for an even greater field of view and a higher level of detail. For particularly high demands on robustness, the Ensenso X30 and Ensenso X36 3D camera systems are optionally available with IP65/67 and therefore protected against dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.
IDS ENSENSO XR SERIES
Working distance 0mm
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The modular 3D camera system with onboard processing The Ensenso XR series combines the flexible, modular design of the Ensenso X series with the advantages of an embedded system. The new powerful XR projector unit with integrated system on chip processes the image data independently, making 3D data available directly from the camera. The 3D performance of the XR series can compete with that of a powerful Core i7 desktop CPU. By shifting the compute-intensive calculations to the camera, they no longer have to be performed by powerful industrial PCs. In addition, the transfer of 3D result data instead of high-resolution 2D raw data reduces the network load. Multi-camera systems in particular benefit from the resource-saving features of the new XR series. A built-in front light supports calibrating the work environment as well as the image quality of the 2D camera images. Besides the GigE data connection, an additional WiFi interface is planned, which will be very useful for temporary access to data and parameters when wiring is difficult or cost-intensive.Similar to the X-series, the XR-series can be flexibly adjusted with selected GigE uEye camera models to a 3D camera system customized to your requirements. With different base lines and focal lengths, working distances of more than 5 meters can be realized and objects with volumes of several cubic meters can be captured, such as heavily laden pallets or entire rooms. The first Ensenso XR models feature 1.6 MP Sony sensors and are protected by IP65/67 against dirt, dust, splash water or cleaning agents, as well as against accidental shifting of the optics.
Hikrobot Line Laser 3D Camera
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The Hikrobot Line Laser 3D Camera is engineered to deliver precise real-time point cloud data, crucial for logistics and warehousing operations. Its standout feature is a high-power laser module combined with a wide dynamic range, enabling accurate measurement of various objects, including challenging black packages. This accuracy is further enhanced by an integrated high-precision measurement algorithm, making it ideal for complex environments where consistent and reliable data is critical.In terms of capabilities, the camera offers high-speed scanning at a rate of up to 600Hz with a 3m/s scanning speed, allowing for dynamic volume measurement of packages with a detection accuracy of 5mm. This capability ensures that the camera can keep up with fast-moving items on a conveyor belt or within automated systems, providing reliable data without slowing down the operation.The Hikrobot Line Laser 3D Camera is particularly well-suited for logistics and warehousing applications where speed and accuracy are paramount. Its robust design and advanced processing capabilities make it a reliable choice for environments that demand continuous, high-precision measurement and data output in real-time, especially in scenarios involving diverse and rapidly moving inventory.
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