ZIVID Zivid One+ Medium Alternatives & Competitors

The Pickit L system stands out as a versatile and cost-effective solution for industrial automation needs. It excels in handling medium to large parts or surfaces, making it ideal for a wide range of applications. Notably, the system accommodates objects with dimensions starting from 50x50x10 mm, showcasing its flexibility in managing various workpieces.

One of the standout features of the Pickit L system lies in its impressive price-performance ratio, offering efficiency without compromising affordability. This makes it an attractive option for businesses seeking automation solutions that deliver exceptional value. Additionally, the system's compatibility with a diverse array of object sizes further enhances its adaptability, proving its utility across various industries and production environments.

In terms of specialized specifications, the Pickit L system's lesser-known attribute might be its capacity to withstand extreme temperatures. This resilience allows it to operate reliably even in demanding environments where temperature variations could be a challenge for other automation systems. Furthermore, its compatibility with specific software systems underscores its seamless integration potential, streamlining implementation and enhancing overall efficiency.

The Pickit L-SD is an affordable yet versatile 3D vision system designed for industrial automation, offering excellent value with its best price-performance ratio. It is capable of handling medium and large parts or surfaces and can work with objects starting from 50x50x10 mm in size. This system is known for its suitability in various applications, providing an ideal balance between performance and cost-effectiveness.

One practical application of the Pickit L-SD is in machine loading, such as the example of JMPT using it for bin picking shafts. The system's performance, low maintenance requirements, and compact design make it a reliable choice for tasks like these. Additionally, it can seamlessly integrate into existing production cells with minimal modifications, as demonstrated by KYB in their bin picking of shock bases. The Pickit L-SD offers an attractive solution for manufacturers seeking efficient automation without breaking the bank.

The Pickit L-SD stands out for its affordability and adaptability in industrial automation. While it may have a lower 3D camera resolution compared to some high-end systems (640x480 pixels), it offers reliable precision, with an estimated picking accuracy of 1.5 to 2 times the 3D camera accuracy. Its lightweight design and compatibility with various software systems make it a practical choice for applications that involve medium to large parts, showcasing its versatility and cost-effectiveness in the field of industrial automation.

The Pickit M-HD is a highly accurate and efficient 3D vision system designed for industrial automation, excelling in the handling of small and medium-sized parts or surfaces. This system boasts impressive precision with a 3D camera precision ranging from 0.15 to 0.8 mm, depending on the distance from the camera and the FOV. It features a 3D camera resolution of 1920 x 1200 pixels and an estimated picking accuracy of approximately 1.5 times the 3D camera accuracy, making it well-suited for applications demanding precise object recognition and manipulation.

One notable application of the Pickit M-HD is in the automotive industry, where it is used to automate tasks such as finding and picking complex 3D parts. For example, Neonent implemented this system to automate manual loading, allowing the robot to locate and handle intricate 3D components with the assistance of the Pickit M-HD system. Additionally, in sheet metal production, Stantraek has leveraged the Pickit M-HD to eliminate the need for part staging with jigs and fixtures through efficient bin picking automation.

The Pickit M-HD offers top-tier performance in 3D vision for industrial applications. Its precise measurements, high-resolution imaging, and remarkable accuracy make it a valuable choice for industries dealing with small to medium-sized objects. Whether it's automating complex tasks in the automotive sector or streamlining sheet metal production through bin picking, this system demonstrates its versatility and reliability in diverse industrial automation scenarios.

The Intel® RealSense™ Depth Camera D415 stands out for its standard field of view, making it well-suited for high-accuracy applications like 3D scanning. With a rolling shutter on the depth sensor, it offers the highest depth quality per degree, enabling precise measurements for smaller objects or when more accuracy is required. The D415 is lightweight, powerful, and cost-effective, making it an ideal choice for development and productization of new sensing solutions and devices that can better understand and interact with their surroundings.

This camera is part of the Intel® RealSense™ D400 series, which includes a complete suite of solutions for simple integration. It combines Intel's latest depth-sensing hardware and software into easy-to-integrate products, including vision processors, turnkey modules, cameras, SDKs, and computer vision libraries. As a result, developers, makers, and innovators can easily bring depth-sensing vision to their devices, fostering a new generation of intelligent vision-equipped solutions.

In industrial automation, the D415's high depth quality and precise measurement capabilities make it a valuable tool for various applications. Its ability to accurately sense and understand the environment can enhance robot guidance, object detection, and inspection tasks. Furthermore, its small form factor and customizable software allow for easy integration into existing systems, making it a versatile option for a wide range of industrial use cases. Additionally, its compatibility with Intel's vision processors and SDKs offers the potential for advanced real-time processing and data analytics in industrial environments.

• Fast
• Accurate
• High Definition + Color
• 3D High Dynamic Range
  

Range: 0.3 m- 1.0 m

Precision: 25 - 500 mm

FOV: 164 x 132 mm
621 x 439 mm

Spatial:
0.18 @ 500 mm
4.00 x 10-4 per distance (z) in mm

• Fast
• Accurate
• High Definition + Color
• 3D High Dynamic Range

Range: 1.2 m- 3.0 m

Precision: 350 to 1800 mm

FOV: 843 x 530 mm
2069 x 1310 mm

Spatial:
0.67 @ 1800 mm
3.67 x 10^-4 per distance (z) in mm

The modular and flexible 3D camera system

The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.

The camera mounting brackets are available in a range of widths to allow for the implementation of base lines with different sizes. You can also configure the camera's angle of view and choose between various C-mount lenses with different focal lengths for the camera and projector. This flexibility facilitates a wide range of working distances of more than 5 metres, allowing you to capture objects with volumes of several cubic metres, e.g. heavily-laden pallets or entire rooms. You can choose between camera models with 1.3 megapixel or 5 megapixel resolution for an even greater field of view and a higher level of detail.

For particularly high demands on robustness, the Ensenso X30 and Ensenso X36 3D camera systems are optionally available with IP65/67 and therefore protected against dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.

The modular 3D camera system with onboard processing

The Ensenso XR series combines the flexible, modular design of the Ensenso X series with the advantages of an embedded system. The new powerful XR projector unit with integrated system on chip processes the image data independently, making 3D data available directly from the camera. The 3D performance of the XR series can compete with that of a powerful Core i7 desktop CPU. By shifting the compute-intensive calculations to the camera, they no longer have to be performed by powerful industrial PCs. In addition, the transfer of 3D result data instead of high-resolution 2D raw data reduces the network load. Multi-camera systems in particular benefit from the resource-saving features of the new XR series.

A built-in front light supports calibrating the work environment as well as the image quality of the 2D camera images. Besides the GigE data connection, an additional WiFi interface is planned, which will be very useful for temporary access to data and parameters when wiring is difficult or cost-intensive.


Similar to the X-series, the XR-series can be flexibly adjusted with selected GigE uEye camera models to a 3D camera system customized to your requirements. With different base lines and focal lengths, working distances of more than 5 meters can be realized and objects with volumes of several cubic meters can be captured, such as heavily laden pallets or entire rooms. The first Ensenso XR models feature 1.6 MP Sony sensors and are protected by IP65/67 against dirt, dust, splash water or cleaning agents, as well as against accidental shifting of the optics.

The compact Visionary-T Mini 3D snapshot cameras from SICK with their simple operation and excellent data quality provide the solution to virtually all industrial 3D machine vision requirements. Thanks to the advanced 3D time-of-flight technology, each pixel delivers extremely accurate depth and intensity data. The camera captures its surroundings extremely reliably even in strong light/dark contrast conditions and at long distances, and delivers precise data even for moving objects thanks to its very short image capture time. A clearly structured configuration tool makes it easy to parameterize the device and flexibly adapt the data to the specific application. This makes Visionary-T Mini an ideal, cost-efficient solution, e.g., for logistics, robotics or industrial vehicles.

At a glance:

• Up to 30 3D images per second at full resolution (512 × 424 pixels)
• Compact housing
• Temperature range: –10 °C to 50 °C
• Enclosure rating: IP65, 67
• 3D data transmission over industrial Gigabit Ethernet