fruitcore robotics horstVISION 3D Alternatives & Competitors

The modular and flexible 3D camera system

The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.

The camera mounting brackets are available in a range of widths to allow for the implementation of base lines with different sizes. You can also configure the camera's angle of view and choose between various C-mount lenses with different focal lengths for the camera and projector. This flexibility facilitates a wide range of working distances of more than 5 metres, allowing you to capture objects with volumes of several cubic metres, e.g. heavily-laden pallets or entire rooms. You can choose between camera models with 1.3 megapixel or 5 megapixel resolution for an even greater field of view and a higher level of detail.

For particularly high demands on robustness, the Ensenso X30 and Ensenso X36 3D camera systems are optionally available with IP65/67 and therefore protected against dirt, dust, water splashes or cleaning agents as well as accidental shifting of the optics.

The modular 3D camera system with onboard processing

The Ensenso XR series combines the flexible, modular design of the Ensenso X series with the advantages of an embedded system. The new powerful XR projector unit with integrated system on chip processes the image data independently, making 3D data available directly from the camera. The 3D performance of the XR series can compete with that of a powerful Core i7 desktop CPU. By shifting the compute-intensive calculations to the camera, they no longer have to be performed by powerful industrial PCs. In addition, the transfer of 3D result data instead of high-resolution 2D raw data reduces the network load. Multi-camera systems in particular benefit from the resource-saving features of the new XR series.

A built-in front light supports calibrating the work environment as well as the image quality of the 2D camera images. Besides the GigE data connection, an additional WiFi interface is planned, which will be very useful for temporary access to data and parameters when wiring is difficult or cost-intensive.


Similar to the X-series, the XR-series can be flexibly adjusted with selected GigE uEye camera models to a 3D camera system customized to your requirements. With different base lines and focal lengths, working distances of more than 5 meters can be realized and objects with volumes of several cubic meters can be captured, such as heavily laden pallets or entire rooms. The first Ensenso XR models feature 1.6 MP Sony sensors and are protected by IP65/67 against dirt, dust, splash water or cleaning agents, as well as against accidental shifting of the optics.

The Helios2 Time of Flight (ToF) camera is an IP67 “factory tough” 3D camera featuring Sony’s DepthSense sensor, engineered for high performance operation in industrial environments. Built for demanding 24/7 environments and a variety of industrial 3D applications such as robotics, 3D inspection, and logistics, including advanced material handling, pick and place, sorting, palletization / de-palletization, volume estimation, and more. The Helios2 delivers sub-millimeter precision and improved accuracy compared to the previous Helios. The calibration between the VCSELs and sensor timing is enhanced resulting in more 3D detail, along with improved edge detection to reduce flying pixels and overall noise.

The camera MV2-D1280-O01-3D06-G1 is based on the ON Semiconductor PYTHON1300 CMOS image sensor. The PYTHON1300 CMOS image sensor is optimized for low light conditions and is available as standard monochrome version. The camera has the GigE interface (GigEVision).

These cameras focus on demanding applications in industrial image processing. They are optimized for low light applications. Due to the global shutter, even high-speed applications with exposure times in the µs-area are possible.

FEATURES:

• Configurable region of interest (ROI)
• Decimation in y-direction
• 2 look-up tables (12-to-8Bit) on user-defined image region (Region-LUT)
• Constant frame rate independent of exposure time
• Temperature monitoring of camera
• Camera informations readable over SDK
• Ultra low trigger delay and low trigger jitter
• Extended trigger input and strobe output functionality
• Status line in picture
• with Shaft Encoder

The camera MV0-D1280-O01-3D06-288-G2 is based on the ON Semiconductor PYTHON1300 CMOS image sensor. The PYTHON1300 CMOS image sensor is optimized for low light conditions and is available as standard monochrome version. The camera has the GigE interface (GigEVision).

These cameras focus on demanding applications in industrial image processing. They are optimized for low light applications. Due to the global shutter, even high-speed applications with exposure times in the µs-area are possible.

FEATURES:

• Configurable region of interest (ROI)
• Decimation in y-direction
• 2 look-up tables (12-to-8Bit) on user-defined image region (Region-LUT)
• Constant frame rate independent of exposure time
• Temperature monitoring of camera
• Camera informations readable over SDK
• Ultra low trigger delay and low trigger jitter
• Extended trigger input and strobe output functionality
• Status line in picture
• with Shaft Encoder

The camera MV0-D2048x1088-C01-3D06-768-G2 is based on the CMOSIS CMV2000 V3 CMOS image sensor. The CMV2000 V3 CMOS image sensor is optimized for low light conditions and is available as standard monochrome version. The camera has the GigE interface (GigEVision).

These cameras focus on demanding applications in industrial image processing. They are optimized for low light applications. Due to the global shutter, even high-speed applications with exposure times in the µs-area are possible.

FEATURES:

• Configurable region of interest (ROI)
• Decimation in y-direction
• 2 look-up tables (12-to-8Bit) on user-defined image region (Region-LUT)
• Constant frame rate independent of exposure time
• Temperature monitoring of camera
• Camera informations readable over SDK
• Ultra low trigger delay and low trigger jitter
• Extended trigger input and strobe output functionality
• Status line in picture
• with Shaft Encoder

The starter kit of the D415e includes the camera itself, a M12 to RJ45 ethernet cable and a M8 power cable with wall plug. It comes fully equipped to start and test the camera quickly.
The FRAMOS Industrial Depth Camera D415e is built with Intel® RealSense™ technology. The depth camera has industrial M12 ethernet and M8 power connectors and features a field of view of approx. 72° (diagonal) for depth and RGB sensors. Its water- and dust resistant housing is optimized for industrial environments. The D415e is ideal for OEMs and integrators who need 3D as well as 2D vision in their products and applications. The wider baseline of the two rolling shutter IR imagers, compared to the D435e, provides higher depth accuracy for applications that require high precision. The D415e is compatible with the Cross-platform SDK for Intel® RealSense™ devices, enabling multiple programming languages, wrappers, sample code and tools.

The 3D CMOS cameras MV4-D2048x1088-C01-3D06-G2 are designed for high triangulation rates. The CMOSIS CMOS image sensor CMV2000, which is optimized for high frame rates and high sensitivity, was combined with two robust algorithms to determine the triangulation line in the FPGA of the camera. The user can either employ a FIR algorithm for asymmetric line profiles or a robust COG algorithm for symmetric profiles.

The triangulation algorithm activated in the camera calculates the line position of a line with 1/16 sub-pixel accuracy. In addition to the output of the height profiles, qualifiers are also output, which can be used to suppress artifacts or characterize the surface.

The camera is equipped with GigE interfaces and is therefore able to capture 3D profiles without a frame grabber or to set up cost-effective multi-camera systems as used for the inspection of profiles. The camera is available with GigE, 10 GigE and 10 GigE fiber interface, according to the GigE Vision and GenICam standards. In addition, the cameras have a complete encoder interface that can be configured for the TTL, RS422, HTL and dHTL interface standards, as well as various outputs. External devices with an RS485 interface can also be optionally controlled. Of course, all I/O's are galvanically decoupled from the camera electronics. The field-tested cooling concept of the MV4 housing provides for a sufficient electronics cooling.

FEATURES:

• Linear Mode / multiple slope (High Dynamic Range Mode)
• Configurable region of interest (ROI)
• Temperature monitoring of camera
• Low trigger delay and low trigger jitter
• Extended trigger input and strobe output functionality
• 4x Isolated inputs or shaft encoder A, B, Z, Y interface (RS422, TTL, D-HTL, HTL)
• 3x Isolated outputs (2x open drain, 1x TTL highspeed)

The 3D CMOS cameras MV4-D1280-L01-3D06-G2 (LUX1310) are designed for high triangulation rates. The LUXIMA CMOS image sensor LUX1310, which is optimized for high frame rates and high sensitivity, was combined with two robust algorithms to determine the triangulation line in the FPGA of the camera. The user can either employ a FIR algorithm for asymmetric line profiles or a robust COG algorithm for symmetric profiles.

The triangulation algorithm activated in the camera calculates the line position of a line with 1/16 sub-pixel accuracy. In addition to the output of the height profiles, qualifiers are also output, which can be used to suppress artifacts or characterize the surface.

The camera is equipped with GigE interfaces and is therefore able to capture 3D profiles without a frame grabber or to set up cost-effective multi-camera systems as used for the inspection of profiles. The camera is available with GigE, 10 GigE and 10 GigE fiber interface, according to the GigE Vision and GenICam standards. In addition, the cameras have a complete encoder interface that can be configured for the TTL, RS422, HTL and dHTL interface standards, as well as various outputs. External devices with an RS485 interface can also be optionally controlled. Of course all I/O's are galvanically decoupled from the camera electronics.

3D triangulation rate at different ROI's:

Features:

• Linear Mode / multiple slope (High Dynamic Range Mode)
• Temperature monitoring of camera
• Low trigger delay and low trigger jitter
• Extended trigger input and strobe output functionality
• 4x Isolated inputs or shaft encoder A, B, Z, Y interface (RS422, TTL, D-HTL, HTL)
• 3x Isolated outputs (2x open drain, 1x TTL highspeed)

The 3D CMOS cameras MV4-D1280-L01-3D06-FB (LUX1310) are designed for high triangulation rates. The LUXIMA CMOS image sensor LUX1310, which is optimized for high frame rates and high sensitivity, was combined with two robust algorithms to determine the triangulation line in the FPGA of the camera. The user can either employ a FIR algorithm for asymmetric line profiles or a robust COG algorithm for symmetric profiles.

The triangulation algorithm activated in the camera calculates the line position of a line with 1/16 sub-pixel accuracy. In addition to the output of the height profiles, qualifiers are also output, which can be used to suppress artifacts or characterize the surface.

The camera is equipped with GigE interfaces and is therefore able to capture 3D profiles without a frame grabber or to set up cost-effective multi-camera systems as used for the inspection of profiles. The camera is available with GigE, 10 GigE and 10 GigE fiber interface, according to the GigE Vision and GenICam standards. In addition, the cameras have a complete encoder interface that can be configured for the TTL, RS422, HTL and dHTL interface standards, as well as various outputs. External devices with an RS485 interface can also be optionally controlled. Of course all I/O's are galvanically decoupled from the camera electronics.

3D triangulation rate at different ROI's:

FEATURES:

• Linear Mode / multiple slope (High Dynamic Range Mode)
• Temperature monitoring of camera
• Low trigger delay and low trigger jitter
• Extended trigger input and strobe output functionality
• 4x Isolated inputs or shaft encoder A, B, Z, Y interface (RS422, TTL, D-HTL, HTL)
• 3x Isolated outputs (2x open drain, 1x TTL highspeed)